ULWⅢ MIP Pro – Unilumin

Application Scenario

Exhibition

House of Worship

What is MIP

MIP（Micro In Package）： Micro LED chips are transferred to the carrier board by using mass transfer technology, package and cut into single pixel-level packages, and subjected to pixel-level inspection and binning. 

MIP 〸 COB Surface Process Technology (EBL+technology)

MIP Technology Advantages

ULWⅢ MIP Pro Technology Advantages

Excellent Visual Performance

EBL+（Enhance black level+）Multiple optical Processing
Adopt multilayer nano-optical material, 8000:1 high contrast ratio, presenting extremely deep black visual with no reflections.

Excellent Visual Performance

3+7 Protections

Stability & Green

Full Flip Chip With Common Cathode — Mini & Micro Chip Level Package • RGB full flip chip，no welding wires，higher Product stability, longer lifespan, failure rate reduced by 50%. • Common cathode design, five-side light emission, higher luminous efficiency, power consumption reduced by 34%（compare with regular SMD）

High flexibility

Flexible shape Support inner curve,right angle and half cabinet Support max 18° inner curve cabinet splicing， a complete circle can be made up with 20 cabinets

Care For Eyes

High integration，more stable

XYZ axis six-way adjustment

Product Parameter

Product	ULWⅢ MIP Pro
Pixel Pitch	0.9	1.2	1.5
Panel Size	600×337.5×47.8mm
Weight	5kg/panel
Brightness	600nits
Maintenance	Front and rear maintenance
Fault monitoring	Indicator light , LCD *
Input Power<Max>	350±10%W/m²	275±10%W/m²	250±10%W/m²
Input Power<Typical>	115±10%W/m²	90±10%W/m²	80±10%W/m²